For many years now, miniaturization has been the main driver of the electronics industry. This is particularly true for ceramic-based circuit boards, which have properties that make them especially suitable for high-frequency circuits. Increasingly demanding technical requirements have exposed the limits of the classic thick-film technologies used for the production of circuit-board conduc-tors. Now, however, a new generation of thick-film pastes and their photolitho-graphic structuring enable the manufacturing of extremely high-resolution thick-film structures necessary for 5G applications. Moreover, this process is suitable for mass production and industrial applications while maintaining low investment costs and only minimally extending production times.