development chain from the design of new chiplet components through prototyping and integration to scalable manufacturing. New technologies for greater competitiveness Not only are microchips part of our daily lives, from brushing our teeth to driving or using our phones, they also play a critical role in key areas like AI, quantum technologies, aerospace and medical technology. Most chips are currently manufactured in Taiwan, China and South Korea. For years, experts and associations have warned of dangerous dependencies and the impending loss of Europe’s competitiveness. At the same time, new technological approaches are necessary: Electronic systems are becoming increasingly complex, energy-efficient and specialized. This brings traditional approaches to their limits. The focus of the microelectronics industry was long on integrating as many functions as possible in a sin- gle chip. However, physical and economic hurdles are making this approach more and more expensive and inflexible. The partners in the APECS project are working on viable alterna- tives for the future, focusing on heterointegration and chiplet technologies. Heterointegration refers to different chips and tech- nologies that are combined within a system. Instead of a single chip, multiple small specialized components known as chiplets work together in a modular sys- tem, such as memory, sensors and power electronics. This enables more targeted system optimization and more flex- ible implementation of new functions. This approach also accelerates the development processes that were previously tedious and reduces costs, especially for smaller lot sizes and specialized applications. Sustainable value for industry In the APECS pilot line, robust, reliable, and scal- able chip systems are to be developed and tested for industrial applications. Dirk Schumann is pulling all the strings. As a physicist, he brings technical understanding and an analytical approach to the role. 30 years of industry expe- rience at companies such as Intel in Ireland, BMW, ASML and Infineon have honed his ability to handle complexity, structure processes and communicate across multiple levels. “My job is to establish a structure with over a hundred individual activities that contribute to a common goal, keeping a handle on the complexity of this project,” the project manager says. In the first step, state-of-the-art semiconductor technology systems will be procured and gradually commis- sioned at various FMD institutes and at European partner organizations. At the same time, the researchers are developing or refining processes and technologies for advanced packaging: inte- grating chiplets and other electronic components into turnkey systems. A key focus of the project is on sustainability. Resource-efficient designs, circular manufacturing and durable electronic systems can be implemented especially well. The partners will ulti- mately share their knowl- edge and insights with other European companies and research institutions in the form of services and training. “APECS essentially serves as a one-stop shop, bundling expertise, infra- structure, technologies and processes and facilitating the transition from research to applications,” explains Schuman n. Despite its technical orientation, it is therefore more than just a research project; it is also an industrial and structural policy initiative with stra- tegic relevance. It is part of the EU Chips Act in which the European Union targets investments in semiconductor technol- ogies to strengthen Europe’s technological resil- ience and competitiveness. “APECS is hard work, but it also generates employment,” says Dirk Schumann. “A lot of people earn their livelihood from it, and our success will create many more jobs and open up great opportunities for the industry.” “My job is to establish a structure with over a hundred individual activities that contribute to a common goal, keeping a handle on the complexity of this project.” Dirk Schumann, FMD D M F , k c o t S e b o d A / t d e t s g r u B h p o t s i r h C : s o t o h P 1 | 26 Fraunhofer magazine European collaboration APECS is designed as a cross-European collabora- tive project. In Germany, twelve Fraunhofer insti- tutes and two Leibniz insti- tutes are bundling their expertise in APECS. Inter- nationally, the consortium includes partners from Austria, Belgium, Finland, France, Greece, Spain and Portugal, including renowned institutions such as imec, CEA Leti and VTT. This European scope enables networking of existing strengths and helps to eliminate dupli- cate structures. APECS is co-funded by the Chips Joint Undertaking and with national funding in the Chips for Europe initiative. — Find out more about the project: https://www.apecs.eu back to page 1 77