Fraunhofer-Gesellschaft

Research Topics of the Fraunhofer Competence Field Additive Manufacturing

Materials

Materials research provides answers to current issues in the fields of energy, health, mobility, information and communication technologies as well as in construction and housing.

Technology

In product development companies are confronted with constantly changing markets. To achieve integrated production processes, it is important to accurately analyze all the processes and technologies involved in the product life cycle and to optimally synchronize the production processes.

Engineering

By taking nature as a role model, scientists develop ideas and products that can be specifically adapted to environmental conditions.

Quality

In order to improve the reliability and shape accuracy of all products generated by addititve manufacturing, we develop individual security systems for your entire product development process.

Software und simulation

Additive manufacturing is closely linked to the digital control of the manufacturing process: components are manufactured directly on the basis of a digital representation.

News

 

Fraunhofer DDMC

The 6th Fraunhofer DDMC took place on March 15th and 16th in Berlin, the next DDMC is schedulded for 12th and 13th March, 2025. Abstract submission is possible unti the end of May 2024.

 

 

Rapid.Tech 3D

We look forward to welcoming you to rapid.tech 3D on 14-16 May 2024 in Erfurt at our booth no. 2-111 or at the expert forum on 16 May.

 

AMTech Expo

On 1-2 December 2023, AMTech Expo took place in Hyderabad, India. The Fraunhofer Competence Field Additive Manufacturing was represented at the German AM Zone with a booth.

 

NEWS 1.23

Please find the latest newsletter in the link below.

 

formnext

formnext 2023 took place in Frankfurt am Main from 7 - 10 November. The Fraunhofer Competence Field Additive Manufacturing presented their exhibits on the Fraunhofer joint booth in hall 11.0, D31.

 

Events

Press releases of the Fraunhofer-Gesellschaft

7.3.2024

Integration of Fraunhofer FEP's Microdisplays and Sensors business unit into Fraunhofer IPMS

The Microdisplays and Sensors business unit at the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be integrated into the Fraunhofer Institute for Photonic Microsystems IPMS with retroactive effect from January 1, 2024. Both institutes are closely connected, particularly within this business unit, and share infrastructure at the Dresden site. By pooling expertise and streamlining structures, we anticipate the creation of synergies that will strengthen the research field, expedite development and thus benefit customers and partners.
more info

1.3.2024

Faster charging with diamonds

Diamond is known for its outstanding thermal conductivity. This makes the material ideal for cooling electronic components with high power densities, such as those used in processors, semiconductor lasers or electric vehicles. Researchers at Fraunhofer USA, an independent international affiliate of the Fraunhofer-Gesellschaft, have succeeded in developing wafer-thin nanomembranes from synthetic diamonds that can be integrated into electronic components, thereby reducing the local heat load by up to ten times. This helps to improve the road performance and service life of electric cars and significantly reduces battery charging time.
more info

1.3.2024

A supercomputer on wheels

Modern cars are packed full of electronics. Managing all the computers and assistance systems is a complex task, and the cable harnesses increase the weight of the car. In the joint research project CeCaS, Fraunhofer researchers are working on a systems architecture based on the idea of managing all electronic components centrally from one computer platform. This will make it easier to construct highly automated, connected vehicles. The core element of this Fraunhofer technology is an extremely reliable Ethernet backbone that works in real time.
more info

1.3.2024

Optimal shipping carton utilization

Products ordered online are often shipped in oversized cartons. The size of the overall package is frequently much larger than its contents. For example, a fragrance bottle is shipped in a shoebox-sized package, which has padding to fill the empty space. This is not sustainable. Helping to combat this issue is the CASTN optimization software created by the Fraunhofer Institute for Material Flow and Logistics IML, which puts together the optimum order-to-carton combination for each customer’s order. Clever algorithms calculate the best carton utilization based on the item and order structure.
more info

Fraunhofer Competence Field Additive Manufacturing Central Office

Nöthnitzer Straße 44

01187 Dresden / Germany

Phone +49 351 4772-2136

Fax +49 351 4772-32136