Fraunhofer at the embedded world 2024

Nürnberg Messe / April 09, 2024 - April 11, 2024

embeddedworld 2024

Hall 4 Booth 422

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intelligent.efficient.connected #WeKnowSolutions

We are looking forward to welcoming you at #ew24 with highlights, projects and innovations in the area of EdgeAI, GreenICT, Sensor Technologies and Systems, Efficient Sensor Communication.

The Fraunhofer EMFT, IESE, IIS, IISB, IMS, IWTM, IZM joined forces for this joint booth of Fraunhofer embedded technologies and solutions.

Highlights for embeddedworld 2024

We demonstrate our latest developments and solutions in the areas of Edge AI, Green ICT, Efficient Sensor Communication and Sensor Technologies and Systems. See you on the digital embeddedworld platform or from April, 9 - April, 11 at our booth in Hall 4-422.

Edge AI

Edge AI Inference

Our embeddif.[ai] technology enables the implementation of AI models on embedded sensor modules for vibration, speech and audio analysis without a cloud connection. Through embeddif.[ai]'s resource-efficient inference, AI applications can be executed directly on the hardware of sensor modules. This enables the identification and analysis of sensor signals with low energy consumption in the mW range on commercial microcontrollers.

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On-Device Training

With our embeddif.[ai] products, you can realize true self-learning IoT systems. The training of AI models takes place directly at the sensor, eliminating the need for cloud communication. This opens new possibilities for self-learning AI applications in the IoT domain. Our hardware-optimized training methods even allow for resource-efficient training of CNNs on embedded systems. This makes autonomous computer vision applications easily achievable.

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NASE/HiL – Find Neural Networks for Edge Hardware Automatically

Data produced by edge devices such as cell phones and vehicles offer immense potential for innovation. Neural networks can intelligently evaluate data on site and thus add value. However, as the available resources such as energy are very limited, implementation is very difficult.

NASE/HiL automatically searches for optimal neural networks while taking hardware limitations into account, thus reducing implementation time and development costs.

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Neuromorphic Computing for Edge AI

Machine Learning applications in embedded devices are a strongly emerging trend. A large number of AI chips has been announced, the first products for embedded AI are on the market. Current neural network architectures like deep neural networks require high computational complexity and power consumption. Neuromorphic hardware in contrast relies on massive parallel processing and performs calculations, e.g. for Machine Learning, faster and with less power. Efficient architectures for neuromorphic hardware with respect to computational performance, power consumption and chip area are therefore a key element for a widespread deployment of neural networks in embedded devices.

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Extreme Edge Computing

Low latency, high data throughput, absolute data sovereignty are advantages when AI inferences are processed directly on end devices. But computing power and storage capacity are often limited there. With our innovative approach, neural networks are therefore executed in a self-regulated manner on multiple IoT devices. Our demonstrator visualizes the data transfer and shows how your own handwriting is processed in a distributed computing process.

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Sensors and AI algorithms for biomedical engineering solutions

Innovations in healthcare with high-precision biomedical sensor technology.

The innovation consists of miniaturized ECG electronics based on artificial intelligence (AI) with a RISC-V processor for data evaluation, which detects atrial fibrillation directly on the patient in real time.

In the »AI-Enhanced Space Suit« project, the sensors are used to measure blood pressure and movements continuously and without a disturbing cuff in the space suit. With the help of AI, critical health conditions are detected at an early stage and passed on to the space travelers as immediate feedback.

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Distance measurement with improved precision and efficiency

Resilient Lidar system design: We develop LiDAR system with high-class detector knowhow. Our custom pixel design ensures efficient ambient light suppression, providing accurate and reliable data. Experience the potential of dynamic selection of region of interest, allowing you to focus on what matters most.

TimestampsAI: The embedded algorithm developed by Fraunhofer IMS bypasses data-driven problems for all future LiDAR sensor solutions. With the compact feature extraction and machine learning algorithms directly based on LiDAR timestamps, future LiDAR systems can be more efficient, effective and robust.

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PredictiveBoX – AI-based condition detection and predictions for machining

The »PredictiveBoX« opens up new horizons for AI-based vibration analysis and applications in production optimization, prediction-based quality control and Industry 4.0 integration. Thanks to our sensor box, you can precisely predict tool wear and remaining tool life and visualize it in real time. This allows you to optimize your production processes with maximum tool utilization, minimized downtime and real-time quality control. Our technology enables easy retrofitting, no speed limitation and high sampling rates – without battery operation.

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Green ICT

Green ICT – Sustainable, energy-efficient and modular sensor platforms

The RF & Smart Sensor Systems (R3S) department at Fraunhofer IZM presents two plug & play sensor platforms that can be used to quickly test and validate wireless and radar sensor concepts.

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Self-powered screw monitoring system with AI support

Safety-critical screw connections on bridges or wind turbines must be regularly maintained to identify wear in time and prevent dangers. This maintenance is associated with a high cost. With the self-powered screw monitoring system Q-Bo®, condition monitoring is carried out specifically, wirelessly, energy-autonomously, and directly at the fastener without the need for modification to the screw itself.

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RFicient® Ultra-low-power Wake-Up-receiver

The energy-efficient RFicient® radio receiver technology with a current consumption less than 3 µA can receive radio telegrams in three license-free frequency bands simultaneously and independently of each other. This makes positioning systems for the localization of objects in warehouses possible, but also worldwide mobile applications, such as container tracking without manual frequency switching. RFicient® is also suitable for building automation, smart lighting, electronic shelf labels, remote maintenance and control, and wireless sensor networks in general. Years of maintenance-free operation is possible with very small batteries and solar cells or with energy harvesting. The particularly short response time in milliseconds also enables real-time applications.

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Efficient Communication Systems

Validate ADAS functions in virtual worlds

Testing driving functions requires thousands of kilometers of test drives after each software change. Virtual test benches enable virtual test drives when real test drives on this scale are not possible. Our toolbox FERAL enables technical coupling of different simulators and executable software components through virtual communication buses across different levels of abstraction to create executable virtual test scenarios.

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Class B and C: New Features for Wireless mioty®-LPWAN

With the new Class B, control commands can also be sent from a base station to the devices. Broadcast features allow all actuators to be controlled via downlink or multicast in a group of actuators. Class C enables immediate downlink communication for fast activation, as demonstrated by a wireless lighting control system.

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JPEG XS SDK (Software Development Kit)

JPEG XS is a video codec for all CPU-, GPU-, FPGA-based or Nvidia Jetson designs which call for a transfer of high resolution video data and an ultra-low latency accordingly to IPMX and ST2110-22.. Fraunhofer IIS provides a JPEG XS SDK Application Support Package to easily implement JPEG XS in typical workflows like camera to stream and stream to display. The JPEG XS SDK is available under licensing. Ask for an evaluation kit or more details.

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Sensor Technologies and Systems

The next generation: Transceiver ASIC for micromachined ultrasonic transducers

Ultrasound is a powerful imaging tool. Capacitive micromachined ultrasonic transducers (CMUTs) offer advantages in miniaturization, high-frequency operation and integration of electronics. Fraunhofer EMFT scientists are working on an energy-efficient ASIC for CMUTs. Our approach eliminates external high voltage bias and isolation switches, improves noise performance and reduces power consumption. At the embedded world we will present our 8-channel ultrasonic transceiver ASIC for CMUT sensor arrays.

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High temperature
4H-SiC CMOS by IISB

IISB’s HT CMOS technology enables fabrication of integrated analog & digital circuits on 150 mm wafers which can operate at temperatures up to 600 °C. Custom solutions also allow for integration of sensors, e.g. UV and temperature, as well as lateral power devices. To support circuit design, a preliminary process design kit (PDK) is provided.

The early access technology is available via EUROPRACTICE as multi project wafer (MPW) technology runs.

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Virtual Development of Autonomous Systems

Mobile autonomous systems such as service robots or transport vehicles are key elements of Industry 4.0. Simulation environments can be used to enable a safe and efficient development process for these units that saves time and resources. With the help of the latest virtual development methods, it is possible to validate them at an early stage and test them against a wide range of requirements. We are happy to support you in the development of robust systems and the use of environmental sensors for robotics and industrial applications.

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Mixed-Signal IC-Design

Integrated sensor electronics that are powerful and energy-efficient are the key to many technical innovations of the future. The basis for this is a mixed-signal IC design that implements these requirements. The increasing miniaturization of semiconductor technologies allows a growing capacity of edge solutions, but is also but is also leading to more complex IC designs. We therefore offer the entire value chain of ASIC development, from extremely energy-saving circuit concepts to design services for high-performance data converters & prototypes.

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Automated Analog Design

Analog design suffers from a very low level of automation, resulting in long development times and poor reusability, coupled with high design risk and development costs. We therefore support you with solutions to enable greater automation in analog design. Among individual support, we’ve developed an approach called Intelligent IP (IIP) that automates typical analog building blocks in a user-friendly manner, thereby speeding up the design process and easing reuse. We help you automate analog design on an individual basis in line with your specific challenges and requests.

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Chiplet Center of Excellence (CCoE)

Chiplets represent one of the most fundamental disruptions since the start of Moore’s Law. The potential of this approach has been recognized for many years, but the massive challenges of e.g. transforming supply chains, design and manufacturing processes are holding it back. To enable novel, industry-ready chiplet solutions Fraunhofer is going to establish the Chiplet Center of Excellence (CCoE). Working in a cooperation between industry and research under the leadership of Fraunhofer IIS/EAS, the center aims to make chiplet technology as usable as possible.

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IC-Design

As one of the leading IC design facilities in Europe, we develop customized solutions to meet the constantly evolving requirements of industrial applications. Our work being independent of technology and manufacturer, we are able to provide our customers with optimum solutions. Our focus is on development of mixed-signal ASICs, intelligent integrated sensor systems, design solutions for increasingly complex electronic systems. Whether for industrial, communications, automotive or any other applications, we are your partner from the idea to the series.

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Bluetooth Analysis System for Automated Testing

To support the development of IoT products with Bluetooth Low Energy (BLE) connectivity, we offer an analysis system that allows you to detect transmission disturbances, anomalies, connection reserves and potential interference sources at an early stage. To avoid unnecessary process steps in the development of IoT products, the analysis tool can be rented and integrated into automated test systems or manual tests.

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Contact persons

Contact Press / Media

Angela Raguse

Corporate communications Nuremberg location

Fraunhofer Institute for Integrated Circuits IIS
Nordostpark 84
90411 Nürnberg, Germany

Phone +49 9131 776 5105

Send email
angela.raguse@iis.fraunhofer.de
www.iis.fraunhofer.de

Contact Press / Media

Susanne Pichotta

Events and trade fairs

Fraunhofer-Gesellschaft
Hansastrasse 27c
80686 Munich, Germany

Phone +49 89 1205-1377

Fax +49 89 1205-7513

Send email
susanne.pichotta@zv.fraunhofer.de

Nürnberg Messe / April 09, 2024 - April 11, 2024

embeddedworld 2024

intelligent.efficient.connected #WeKnowSolutions

Highlights for embeddedworld 2024

Edge AI

Edge AI Inference

On-Device Training

NASE/HiL – Find Neural Networks for Edge Hardware Automatically

Neuromorphic Computing for Edge AI

Extreme Edge Computing

Sensors and AI algorithms for biomedical engineering solutions

Distance measurement with improved precision and efficiency

PredictiveBoX – AI-based condition detection and predictions for machining

Green ICT

Green ICT – Sustainable, energy-efficient and modular sensor platforms

Self-powered screw monitoring system with AI support

RFicient® Ultra-low-power Wake-Up-receiver

Efficient Communication Systems

Validate ADAS functions in virtual worlds

Class B and C: New Features for Wireless mioty®-LPWAN

JPEG XS SDK (Software Development Kit)

Sensor Technologies and Systems

The next generation: Transceiver ASIC for micromachined ultrasonic transducers

High temperature 4H-SiC CMOS by IISB

Virtual Development of Autonomous Systems

Mixed-Signal IC-Design

Automated Analog Design

Chiplet Center of Excellence (CCoE)

IC-Design

Bluetooth Analysis System for Automated Testing

Contact persons

Contact Press / Media

Angela Raguse

Contact Press / Media

Susanne Pichotta

High temperature
4H-SiC CMOS by IISB