Double the cooling effect

Higher processor performance with microchannel cooler

Research News / 2.10.2017

One of the limiting factors for the computing power of processors is the operating temperature. As part of the CarriCool project under the aegis of IBM, Fraunhofer researchers have developed a new, effective cooling method: By integrating microchannels into the silicon interposer it is for the first time possible to cool high-performance processors from the underside as well. As a result, this innovation can achieve a significant increase in performance. Moreover, the scientists have integrated passive components for voltage regulators, photonic ICs and optical waveguides into the interposer.