Fraunhofer at the
electronica

November 15 − 18, 2022 in Munich, Germany

We know electronics

Munich, Germany / November 15, 2022 - November 18, 2022

Fraunhofer at the electronica

World’s leading trade fair and conference for electronics

https://electronica.de

Stand B4/258

The world's leading trade fair and conference for electronics, electronica is the most important meeting place for the international electronics industry. Eight Fraunhofer Institutes provide insights into their latest electronics innovations. The spectrum of exhibits ranges from sensor technology and the Internet of Things (IoT) to energy harvesting, power electronics and neuromorphic hardware. Other focal points are virtual prototyping, battery production or augmented reality for industrial production.

Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP

Modular AR assistance for industrial manufacturing

more info (fep.fraunhofer.de)

Fraunhofer FEP

At electronica 2022, the prototype of an AR assistance system for industrial manufacturing in electronics and aircraft construction from the secureAR project will be presented which ensures improved work and production processes for factories of the future. The modular system integrated in a bump cap includes OLED microdisplays and additional cameras. This allows operating instructions or information to be displayed specifically to people remote from the location. The sensors and interfaces are expandable and the container-based server structure allows controlled data storage.

Fraunhofer Institute for Integrated Circuits IIS

Energieautarke IoT-Kommunikation mit Energy Harvesting in 5G

more info (iis.fraunhofer.de)

Fraunhofer IIS

The industrial Internet of Things consists of millions of sensors, each of which requires only small amounts of energy, but which in total are very energy-intensive. With energy harvesting technologies, these sensors can draw energy from heat, light or vibration and thus operate completely autonomously - without any cables or batteries. Among other things, a narrowband IoT module that transmits supply data in a 5G network will be on display. This paves the way not only for energy-autonomous supply of LPWANs, but also for other radio systems with higher energy consumption and other functionalities such as bidirectional communication and operation in a public network.

Fraunhofer Institute for Integrated Circuits IIS, Division Engineering of Adaptive Systems EAS

more info (eas.iis.fraunhofer.de)

Fraunhofer IIS/EAS

The "Virtual System Development" group at Fraunhofer IIS/EAS is working on solutions for the efficient design of complex control electronics in a virtual environment. This saves time during development and reduces the error rate. Experience about the behaviour of the electronics in certain scenarios can already be gathered in a virtual world and transferred to the prototype.

Another research topic is automated driving and, among other things, the virtual validation of vehicle systems.

Fraunhofer Institute for Laser Technology ILT

Additive manufacturing of individualized, embedded strain gauges combined with wireless data transmission

more info (ilt.fraunhofer.de)

Fraunhofer ILT

Fraunhofer ILT develops process chains for the additive manufacturing of embedded sensors (e.g. strain gauges) on and into components from areas such as drive and gear technology, large machines, power generation, rail vehicles and aerospace. Laser-based technologies enable the resource-efficient, individualized and low-cost mass production of “smart parts”. These sensing components provide data on their production status and condition which is a central aspect of current developments in “Industry 4.0”, for instance predictive maintenance, Big Data and AI approaches.

Furthermore the experts of Fraunhofer ILT will be presenting technological highlights and the latest developments in laser-based manufacturing for batteries and electronics.

Fraunhofer Institute for Physical Measurement Techniques IPM

more info (ipm.fraunhofer.de)

Fraunhofer IPM

Fraunhofer IPM offers services for 3D computed tomography combined with electronics testing at component level. In addition, in the area of thermal management, we offer solutions for cooling electronics based on heat pipes and Peltier cooling. Exhibits will be shown for this purpose: Novel designs of heat pipes such as the pulsating heat pipe and new concepts for Peltier cooling.

Fraunhofer Institute for Photonic Microsystems

Edge KI

more info (ipms.fraunhofer.de)

Fraunhofer IPMS

In everyday life, digital helpers - such as smart apps or cars that think for themselves - are already firmly integrated. Currently, however, the processing of data is mostly done on large, external servers. Embedded artificial intelligence (edge AI) is intended to change this and enable the processing of data and algorithms directly on the end device. However, the performance of edge AI, especially in very small devices, is currently still very limited. The Fraunhofer Institute for Photonic Microsystems IPMS is therefore researching innovative solutions to integrate machine learning algorithms into everyday devices.

Fraunhofer Institute for Silicon Technology ISIT

NeurOSmart: Development of a smart LiDAR sensor with integrated neuromorphic data processing picks up speed

more info (isit.fraunhofer.de)

Fraunhofer ISIT

In the Fraunhofer flagship project NeurOSmart, five institutes are jointly researching a highly energy-efficient and intelligent sensor for the next generation of autonomous systems. After nearly a year of the project, the Fraunhofer researchers will present the to be anticipated sensor system and the hybrid, neuromorphic data processing pipeline at Electronica.

Fraunhofer Institute for Reliability and Microintegration IZM

Radar and Gesture Recognition

more info (izm.fraunhofer.de)

Fraunhofer IZM

Our experts focus on the optimized design and characterization of RF/millimeter-wave radar modules using the M3 approach (methods, models, measures). Based on the application requirements, the implementation concept is developed in conjunction with the M3 approach. This consists of hardware, packaging and test concepts. In the implementation phase, the influences of the packaging technologies and their process variations on the system properties are already taken into account. This avoids re-design iterations, which helps to shorten development time and reduce development costs.

Contact

Contact Press / Media

Roman Möhlmann

Section Manager for Science Communication

Fraunhofer-Gesellschaft
Hansastraße 27c
80686 München, Germany

Phone +49 89 1205-1314

Fax +49 89 1205-771314

Send email

Contact Press / Media

Susanne Pichotta

Project manager electronica

Fraunhofer-Gesellschaft
Hansastrasse 27c
80686 Munich, Germany

Phone +49 89 1205-1377

Fax +49 89 1205-7513

Send email